| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing copper and copper-alloy foils which are capable of being bonded, as a copper foil for flexible substrate, to resins for substrate, such as epoxy resin and polyimide resin, in a rolled state without roughening plating. SOLUTION: At the time of heating a copper foil containing >=100 ppm oxygen in a reducing atmosphere containing >=10% hydrogen, heating is performed so that the area ratio defined as [(the sum total of the areas of interstices existing in grain boundaries) + (the sum total of the areas of blowholes existing within crystalline grains)]/(the length of a measuring range multiplied by its width) becomes 0.02-0.10, based on the surface obtained by magnifying the surface of the foil, after heating, 300 times.
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