发明名称 RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin molding apparatus for obtaining a cured article of a resin for molding which has little bubbles inside, wherein the resin for molding stored in a pot is sandwiched between an injection plunger and a pressure regulating plunger and pressurized and then pressure is applied with the injection plunger to supply the resin to a cavity via a runner. SOLUTION: Heat conductance from a pressure regulating plunger 18 is increased so as to decrease the viscosity of a resin A for molding, by forming, on the surface of the plunger 18 facing an injection plunger 17, a protrusion 182 which protrudes toward the side of the plunger 17, or a depression 184 which is depressed toward the side opposite to the plunger 17.
申请公布号 JP2000271952(A) 申请公布日期 2000.10.03
申请号 JP19990083896 申请日期 1999.03.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TSUJINO HIROYUKI;NAKAMURA HITOSHI
分类号 B29C45/02;B29C45/14;B29C45/53;B29C45/58;(IPC1-7):B29C45/02 主分类号 B29C45/02
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