Copper/steel laminated sheet for use in manufacturing printed circuit boards

摘要

A sheet laminate for use in a press lay-up between printed circuit board panels having a metal substrate layer and a copper foil layer disposed on at least one surface of the substrate layer. The foil layer is attached onto the surface of the substrate layer by a plurality of metal-to-metal bonds disposed along the boundary of the foil layer such that gaps are defined between the bonds.