发明名称 Wiring board with an insulating layer to prevent gap formation during etching
摘要 A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.
申请公布号 US6127634(A) 申请公布日期 2000.10.03
申请号 US19950490083 申请日期 1995.06.13
申请人 FUJITSU LIMITED 发明人 HIGASHIGUCHI, YUTAKA;HOSOGAI, MASAO;OTAGURO, HIROYUKI;YOKEMURA, HITOSHI;HIDA, MASAHARU
分类号 H05K1/11;H01L21/48;H01L23/12;H01L23/495;H05K1/02;H05K1/03;H05K1/05;H05K3/06;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H01R9/09 主分类号 H05K1/11
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