| 摘要 |
<p>PROBLEM TO BE SOLVED: To maintain continuity between electrodes by electrically connecting a bump formed on a chip electrode of a bare chip component, which is deformed until the deformation quantity becomes saturated, to a substrate electrode formed on a printed board. SOLUTION: A bump 4 formed on a chip electrode 3 of a bare chip component 1 is deformed by pressing until the quantity of deformation becomes saturated to cause an end part of dimension T1 of the bump 4 which projects from the main body of the bump 4 to project by about 2-3μm. Then, the bump 3 is electrically connected to a substrate electrode 6 of a printed board 2, and the bare chip component 1 and the printed board 2 are fixed to each other using an adhesive 7. With this method, the continuity between the bump 4 and the substrate electrode 6 can be maintained.</p> |
