| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition usable for a soldering resist layer, an interlayer resin insulating layer, etc., and excellent in cracking resistance and adhesion to a conductor circuit under heat cycle conditions by using the (meth)acrylate of epoxy resin, a curing agent and a P-containing (meth)acrylic ester monomer. SOLUTION: The photosensitive resin composition comprises the (meth) acrylate of epoxy resin, a curing agent and a P-containing (meth)acrylic ester monomer. This monomer is preferably a compound of formula I or II. In the formula I and II, (n) is 0 or 1 and (a) to (c) are each 1 or 2. A resin layer obtained by curing the photosensitive resin composition has high flexibility because a reaction product of the P-containing (meth)acrylic ester monomer is contained and brittleness peculiar to the epoxy resin can be improved. |
