| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer support device of a structure, wherein a semiconductor wafer can be uniformly and closely supported, there is no possibility of a fall-off or the like even at the time of transportation of the wafer, and there is not a possibility that electrostatic breakdown of the wafer or the like is generated at the ion implantation. SOLUTION: This semiconductor wafer support device is one constituted in such a structure that a semiconductor wafer 12 with a resist 13 coated on its upper surface is mounted on a back plate 11, and the outer peripheral part of the wafer 12 is fixed with clamps 15. The clamps 15 have a downward slant surface 17 and at the same time, are dividedly arranged in the direction of the outer periphery of the wafer 12. The wafer 12 is fixed in such a way that the outer peripheral ends of the wafer 12 are independently pressed by the slant surfaces 17 from the upper side.</p> |
