| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin type coil and a method of manufacturing the same, wherein a thinner multilayer coil than a thin type coil using a printed wiring board can be obtained, and wherein thin type coils can be manufactured at a low cost and a high yield due to the absence of warpages, cracks and chips which are present in a thin type coil using a ceramic board. SOLUTION: A ceramic powder is blended with an organic binder or a binder, such as water glass and formed into sheet-shaped composite sheets 1 using a film-forming machine, a printing machine, or the like. Using conductors, planar coils 2a, 2b and 2c are formed on the surfaces of the sheets 1. A plurality of coil boards 10a, 10b and 10c made of these sheets 1 are superposed upon another. During the superposing operation, the coils 2a, 2b and 2c are connected to one another through through-holes 3a, 3a', 3b and 3b' and 3b", and 3c and 3c", thereby preparing a multilayer coil. The multilayer coil is made rigid by thermal compression using a hot press or the like after lamination. Through such a manufacturing method and structure design, a thin type multilayer coil 10 can be obtained without sintering, and hence IC cards and antennas for portable terminals can be provided in small and thin sizes as well as at low cost.
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