| 摘要 |
PROBLEM TO BE SOLVED: To improve the joint strength to a substrate by laminating a peeling layer and electrolytic copper plating layer on the surface of copper foil whose surface roughness is equal to a specific value or less, and roughening the surface of the electrolytic copper plating layer. SOLUTION: On one side of a copper foil 1, which is a carrier with surface roughness 1.5μor less, a peeling layer 2 and an electrolytic copper plating layer 3 are formed sequentially, and a surface 3a of the electrolytic copper plating layer 3 is roughened. The roughened surface 3a is stacked to a base material before the entire is thermally press-fitted, and the carrier copper foil 1 is peeled and removed, and the side of the electrolytic copper plating layer 3 which is to be jointed to the carrier copper foil 1 is exposed, where a prescribed wiring pattern is formed. Thus, the joint strength to the base material is improved, with not pinhole despite the small value for surface roughness.
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