发明名称 PHOTOMASK, EXPOSING METHOD AND ALIGNER
摘要 <p>PROBLEM TO BE SOLVED: To realize an accurate exposure pattern by exactly obtaining optimum exposure corresponding to the change of the sensitivity of a resist. SOLUTION: A chip pattern and a pattern for measuring sensitivity are exposed on the resist (S1), the film thickness of a part on which the pattern for measuring sensitivity on the resist is exposed is measured (S2), and correction exposure is decided from the measured result and a resist film thickness and exposure table previously obtained (S3), then, correction exposure is performed with the correction exposure (S4).</p>
申请公布号 JP2000267259(A) 申请公布日期 2000.09.29
申请号 JP19990071602 申请日期 1999.03.17
申请人 TOSHIBA CORP 发明人 NAKASUGI TETSUO;ITO MASAMITSU;ABE HIDEAKI
分类号 H01L21/027;G03F1/20;G03F1/70;G03F7/20;(IPC1-7):G03F1/08;G03F1/16 主分类号 H01L21/027
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