| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card provided with a flat surface. SOLUTION: In this IC card 1 for which an IC chip 3 is buried in a chip loading part 21 of a card base material 2 by a resin, the resin is in the two-layer structure of a first resin layer 5 and a second resin layer 6. Then, the first resin layer 5 is for fixing the IC chip 3 to the chip loading part 21 and the surface is practically formed higher than the upper surface of the IC chip 3 and lower than the surface of the card base material 2 in the thickness direction of the IC card 1. The second resin layer 6 is laminated on the first resin layer 5 and the surface is formed so as to be the same plane as the surface of the card base material 2. |
