| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition capable of exposure with UV and development with a dilute aqueous alkali solution, forming a coating film with a wide heat management range in which the hardening degree of the unexposed part in drying is controlled prior to removal in development, having high sensitivity and suitable for a soldering resist film for a printed circuit board excellent in heat resistance, electric insulating property and chemical resistance. SOLUTION: The photosensitive resin composition contains a photosensitive prepolymer obtained by allowing at least part of the epoxy groups of a polyfunctional epoxy resin to react with at least one of acrylic acid and methacrylic acid and to react further with at least one of a polybasic acid and its anhydride and by allowing formed carboxyl groups to react with a glycidyl compound having at least one unsaturated group in one molecule and other than glycidyl (meth)acrylate, a photopolymerization initiator, a reactive diluent and a thermosetting compound. |
