| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder bonding terminals to a capacitor chip from re- melting and penetrating around to establish short circuit in a chip capacitor, in which a capacitor chip and terminals are embedded in a resin base from above. SOLUTION: The top of a resin base is depressed to form a capacitor receiving space 7, into which and by which a capacitor chip 2A is fitted in from above the base and is supported. A through-hole 9, through which the tip end side of a terminal 5 is passed, is formed at each of four corners of a top surface 15 of the base around a capacitor-receiving space 7, and a trench 8 in which an end portion 5A of the terminal 5 is fitted is formed at each corner of the top surface 15. Depressions or projections 13, preventing capillary action and regulating solder wicking between both electrodes 3, 4 of the chip capacitor 2, are formed on inside peripheral walls 12 of a capacitor receiving space 7 opposite to the capacitor chip 2A.
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