PATTERNED ORGANIC CONDUCTOR LAYER AND FORMING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To easily form a finely patterned layer on a substrate by removing a resist layer and an organic conductor layer on the upper surface by dipping the substrate in resist peeling liquid after the organic conductor layer is coated on the substrate forming the resist layer. SOLUTION: On a substrate 1, an interlayer insulating layer 2 made of heat resistant resin having a silica skeleton is formed. In a part to eliminate an organic conductor layer 4 on this layer 2, a novolak based positive resist layer 3 is preliminarily patterned and formed. The organic conductor layer 3 is coated on the whole surface of the substrate 1. The whole of this substrate 1 is dipped into novolak based positive resist peeling liquid and is exposed to supersonic wave, and the resist film 3 and the organic conductor layer 4 on the resist film 3 are dissolved and removed. As a result, a desired organic conductor layer 5 made into a main pattern by remaining the organic conductor layer 4 directly formed on the substrate 1 is obtained. Or, etching working is performed for the substrate 1 in which the resist layer 3 is formed and an organic conductor film of a part in which the resist layer 3 is not formed is eliminated.