| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of, and improve the resistance to bending stress of, a semiconductor package by forming holes in a resin tape board and adhesive and connecting connecting terminals to wiring through the connecting holes filled with conductive resin. SOLUTION: A semiconductor chip 1 with an electrode pad 2 and a protective film 3 formed thereon is faced opposite to a resin tape 5 with a wiring 6 formed thereon, so that the non-wiring 6 formation side comes to the semiconductor chip side and they are bonded together via an adhesive 4. A through-hole is formed in the wiring 6, the resin tape 5 and the adhesive 4 in the position corresponding to the electrode pad 2 on the semiconductor chip 1 and conductive resin 8 are applied to the through-hole using a dispenser 7. The electrode pad 2 on the semiconductor chip 1 is connected with the wiring 6 formed on the resin tape 5 through the conductive resin 8 to form a semiconductor package.
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