| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC carrier and an IC socket capable of preventing contact failures between the ball terminals of a BGA-type IC and the contacts of the IC socket and the occurrences of damage and breaking-off, etc., in the ball terminals. SOLUTION: An IC socket comprises a guide pin 33 vertically raised outside a part of a socket main body 31 at which contacts 22 are arranged, a carrier film 41 formed of an insulating film and provided with through holes 41a of diameter into which ball terminals 3 are loosely fitted, a frame 42 adhered to the circumferential edge part of the carrier film 41 and provided with a guide hole 42a into which the guide pin 33 is fitted, an IC holding plate 43 pivoted at the circumferential edge part of the socket main body 31 with play at its right, left, front, and rear sides, and a mechanism to house an IC and lower the IC holding plate 43 fixing the carrier film 41 while holding the IC holding plate 43 horizontally so that the ball terminals 3 may be fitted into the through holes 41a. In the IC socket, the relative location between the guide hole 42a and the through holes 41a is matched with the relative location between the guide pin 33 and the contacts 22.
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