| 摘要 |
PROBLEM TO BE SOLVED: To perform highly reliable burn-in on bare chips by preventing energization failures and damage to circuits and electrode pads formed on chips. SOLUTION: A substrate 1 for burn-in is provided with a substrate main body 2 which comprises terminals 3 to be electrically connected to a burn-in device 4, and is provided with a through hole 6 for fixing a bare chip 5 at the center part by suction; and a plurality of bonding pads 7 which are formed at upper-surface outer edge parts of the substrate main body 2 and are electrically connected to the terminals 3. A bare chip 5 with electrode pads 5a is fixed onto the through hole 6 by suction. Then the electrode pads 5a of the bare chip 5 are connected to the bonding pads 7 of the substrate 1 or burn-in with bonding wires, and voltage is impressed on any desired terminal 3 to perform burn-in on the bare chip 5.
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