| 摘要 |
PROBLEM TO BE SOLVED: To reduce the mounting area of a semiconductor element on a circuit board and to miniaturize a semiconductor mounting component. SOLUTION: This semiconductor mounting component is provided with the circuit board 1 provided with a circuit pattern 2 on an upper surface, a first semiconductor element 3 mounted on the circuit board 1 and a second semiconductor element 4 mounted on the first semiconductor element 3. The first semiconductor element 3 is provided with an electrode electrically connected to the connection part of the circuit pattern 2 of the circuit board 1 on the lower surface side, and the second semiconductor element 4 is provided with an electrode 6 on the upper surface side. The electrode 6 of the second semiconductor element 4 and the connection part of the circuit board 1 positioned on the outer part of the first semiconductor element 3 are connected with a lead wire 7, and the lead wire 7 and the first and second semiconductor elements 3 and 4 are covered with mold resin 8 on the upper surface side of the circuit board 1. |
