| 摘要 |
PROBLEM TO BE SOLVED: To obtain micro-wave and milli-wave circuit devices which have a high performance and high reliability, can be made in a package or a module at a low cost and can be mass-produced, by enclosing an internal circuit of an MMI chip or a transistor chip by an insulating wall and by providing an underfill at the outer side. SOLUTION: Input and output terminals 2 and 3 of a module mother substrate 1 and an amplifier circuit 5 for an MMI chip 4 is junctioned with by bumps 6. An insulating wall 11 is so provided as to enclose the internal input and output terminals 2 and 3 and the inside of bias terminals. Additionally, an underfill 7 is provided at a part including the bumps 6 at the outside of the insulating wall 11. Because the insulating wall 11 is so formed as to enclose the major circuit and resin does not invade under the circuit 5 even if the underfill 7 is made, the circuit property hardly degrade or change. Also, the MMI chip 4 can be realized under the condition of sealing or packaging in a chip level by the insulating wall 11 and the underfill 7.
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