| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for machining by aligning a second main face and a first main face at manufacturing of a side face incident light receiving element, in which incident lights from the side face direction of a light receiving element are refracted and received by a light receiving region. SOLUTION: A light receiving element 100, in which incident lights from the side face direction of a light receiving element 100 are refracted and received by a light receiving region 106, is provided with a semiconductor substrate 101 having a first main face 102 and a second main face 109, the light receiving region 106 formed on the first main face 102 of the semiconductor substrate 101, a slope 108 formed across the first main face 102 on the semiconductor substrate 101, and a reflector 110 formed on the second main face 100 of the semiconductor substrate 101. Incident lights from the side face direction of the light receiving element 100 are refracted, and made incident from the outside part of the semiconductor substrate 101 through the slope 108 to the semiconductor substrate 101, and are reflected by a reflector 110, and transmitted to the light receiving region 106.
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