| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin sealed type non-contact data carrier capable of being thinned without scratching a non-contact data carrier element and without damaging surface smoothness. SOLUTION: This method is provided with a process for forming the laminated body of a base material film 1, the non-contact data carrier element 2 provided on one of the surfaces of the film 1, a photo-curing resin composition layer formed so as to cover the entire non-contact data carrier element 2 and a transparent film for covering the photo-curing resin composition layer and indicating a peeling property to a hardened resin layer 4b formed by curing the photo-curing resin composition, a process for radiating light beams through the transparent film and forming the cured resin layer 4b, a process for peeling off the transparent film and a process for sticking a cover film 6. |
