发明名称 ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic apparatus, in which even a CPU of a BGA can be cooled efficiently by a method, wherein the CPU in which a weighting limit is installed can be thermally connected stably within the weighting limit. SOLUTION: A first heat sink 25 is mounted on a CPU 23 via a heat transfer sheet 26, A plurality of heat transfer parts 25a are formed on the first heat sink 25. A second heat sink 27 is arranged on the first heat sink 25. Opening parts 29, into which the heat transfer parts 25a can be inserted by keeping a gap, are formed in the second heat sink 27. Heat conductive grease is filled between the heat transfer parts 25a and the opening parts 29.</p>
申请公布号 JP2000269671(A) 申请公布日期 2000.09.29
申请号 JP19990074897 申请日期 1999.03.19
申请人 TOSHIBA CORP 发明人 SHIBAZAKI KAZUYA
分类号 G06F1/20;F28F13/00;H01L23/433;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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