发明名称 MOUNTING DEVICE FOR FIXING SEMICONDUCTOR WATER HAVING LINEAR EDGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a mounting device of a structure, wherein a semiconductor wafer having one linear edge is not only made horizontally fixed but also prevented from being damaged on the corners of the wafer. SOLUTION: This device is a mounting device for fixing a semiconductor wafer, which consists of a round base to be mounted with the wafer and a round clamp consisting of a round aperture 28 having a plurality of teeth provided at equal intervals, on the peripheral side of the aperture 28 for fixing the wafer on the base by applying a pressure under the lower part of the water, when the wafer is mounted on the base and has one linear edge.</p>
申请公布号 JP2000269309(A) 申请公布日期 2000.09.29
申请号 JP19990075877 申请日期 1999.03.19
申请人 UNITED MICROELECTRON CORP 发明人 CHOU CHII-HON;RUU UEN-CHOAN
分类号 H01L21/683;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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