| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a pitch to be finer in a flexible wiring board (COF) where a semiconductor chip is loaded on a film substrate. SOLUTION: A connection terminal 11 placed on the upper face of a film substrate is formed of a linear connection terminal main body part 11a, and a planar/circular tip reinforcing part 11b installed at the tip reinforcing part of the connection terminal main body part 11a. For making the length of one side in a connection electrode 12 arranged below a semiconductor chip and an array pitch P to be small and making the pitch fine, the tip reinforcing part 11b is prevented from being easily peeled from the film substrate, when the diameter of the tip reinforcing part 11b is made similar to the length L of one side of the connection electrode 12, even if the width T of the connection terminal main body part 11a is made smaller than the length L of one side of the connection electrode 12 by certain degree, by considering bonding precision at the time of loading the semiconductor chip on the film substrate.</p> |
