| 摘要 |
PROBLEM TO BE SOLVED: To enhance reliability in solder connections by the use of a solder bump in a method for cutting a semiconductor element and its mounting method. SOLUTION: A solder bump 4 is formed on the electrode surface of each semiconductor element of a semiconductor wafer 3, in which a plurality of semiconductor elements are integrally formed, and next this solder bump 4 side is set to a lower face side, and the semiconductor wafer 3 is installed on a soft plate 2, and thereafter an adhering tape 6 is pressed against a face at a side opposite to the solder bump 4 of the semiconductor wafer 3 for adhering, and next the adhering tape 6 side is put downwardly, and the semiconductor elements formed as pieces from the semiconductor wafer 3 are formed by cutting. |
