| 摘要 |
PROBLEM TO BE SOLVED: To reduce construction cost by installing at least two processing devices for applying treatment to a semiconductor device, in manufacturing processes and installing a storage room for storing the semiconductor device along these processing devices. SOLUTION: A clean room comprises a wafer storage room 3 for storing wafers, a working zone 5 for carrying the wafers from the wafer storage room 3, and a processing device 1 for applying specified treatment to the wafer carried to the working zone which are installed around the working zone 5. The wafer storage room 3 is installed inside the working zone 5. By installing a transportation means in the wafer storage room 3, the wafers can be stored efficiently. It is preferable that the wafer storage room 3 be installed, in contact with an interprocess transportation path 7 to store the carried wafer in a specified place efficiently, to simplify the facility and thereby to reduce the construction cost. |
