| 摘要 |
A chip light-emitting device with a substrate (12), an end of which a notch (17) is formed while on both sides of the other of which two notches (18a, 18b) are formed. On the substrate surface, a first and a second electrode pattern (13, 14) are formed covering the notches on the both ends, and a light-emitting-diode (LED) chip (11) is connected to the first electrode pattern (13) while an electrode (11a) of the LED chip (11) is connected by wire bonding to a surface-side electrode (14a) of the second electrode pattern (14) with a metal wire (15). The LED chip (11) and the metal wire (15) are encapsulated with a translucent resin (16). The wire-bonding between the surface-side electrode (14a) of the second electrode pattern (14) and the metal-wire terminal (15a) remaining between the two notches (18a, 18b) is made on the substrate (12). As a consequence, wire bonding can be made stably. Also, polarity recognition is simply made from its external appearance. Furthermore, the handling is smooth.
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