发明名称 DISCRETE COMPONENT IN-MOLD MOUNTING
摘要 A leadless circuit element holder includes opposing flanges which can be bent downwardly for bending the flanges into hands (4, 6) and fingers (5, 7) for holding a leadless circuit element (2) within a plastic mold (14). The holder includes an insert displacement connection via grooves (38) integral to a frame (10) for allowing the leadless circuit element (2) to be included in a circuit. Further, the assembly is insert molded in plastic (14).
申请公布号 WO0048437(A8) 申请公布日期 2000.09.28
申请号 WO2000US02733 申请日期 2000.02.04
申请人 METHODE ELECTRONICS, INC. 发明人 VAN VOOREN, GREGORY
分类号 H05K7/12;H05K3/20;H05K3/32;H05K3/40;H05K7/06;H05K7/08;H05K7/10;(IPC1-7):H05K7/02 主分类号 H05K7/12
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