发明名称 HEAT TREATING METHOD FOR THIN FILM AND FORMING METHOD FOR THIN FILM
摘要 <p>A heat treating method for a thin film, which heat-treats a thin film having a metal silicide layer containing phosphorus atoms and which comprises a temperature raising step, a temperature maintaining step and a temperature lowering step, wherein a thin film is heated in an oxidizing gas or in a gaseous atmosphere containing an oxidizing gas at least in the temp. raising step. An oxide film formed on a thin film during the temp. raising step prevents a release of phosphorus atoms.</p>
申请公布号 WO2000057463(P1) 申请公布日期 2000.09.28
申请号 JP2000001665 申请日期 2000.03.17
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