| 摘要 |
<p>An apparatus (10) to heat and test a semiconductor wafer (14) includes a probe card (13) and tests a plurality of die simultaneously at wafer level. In the present invention, the apparatus heats the wafer using a heater (16) to sufficient temperatures to perform burn-in and a speed test. The wafer is removably mounted on the planar surface (15) of a first support member and the probe card is removably mounted on a second support member (12). The two support members can be disengageably coupled with two hinged arms (18). The apparatus and method eliminate steps associated with handling individually packaged parts, reduces burn-in space and consolidates certain test steps.</p> |
