| 发明名称 |
Microelectronic joining processes |
| 摘要 |
A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts. |
| 申请公布号 |
AU3623000(A) |
申请公布日期 |
2000.09.28 |
| 申请号 |
AU20000036230 |
申请日期 |
2000.03.10 |
| 申请人 |
TESSERA, INC. |
发明人 |
MASUD BEROZ;BELGACEM HABA;KLAUS-JURGEN WOLTER |
| 分类号 |
H01L21/283;H01L21/288;H01L21/56;H01L21/60;H01L21/603;H01L21/68;H01L23/31;H01L23/48 |
主分类号 |
H01L21/283 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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