发明名称 |
A non-conductive intermediate frame for circuit boards |
摘要 |
A non-conducting frame 1 for fitting between printed circuit boards is constructed as a single piece moulding. The frame 1 has a number of slots in the inner surfaces of its side walls and a number of screw bosses formed as part of the moulding. Identical dual spring connectors 10 are pressed into the slots 6 in the side walls to provide electrical connections to circuit boards fitted to the top and bottom of the frame. The dual spring connectors are symmetric about one major axis and therefore are accepted into a slot 6 in either one of two orientations. The screw bosses provide for clamping of the frame to the circuit boards.
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申请公布号 |
GB2348320(A) |
申请公布日期 |
2000.09.27 |
申请号 |
GB19990006364 |
申请日期 |
1999.03.20 |
申请人 |
* NEC TECHNOLOGIES |
发明人 |
MARC SIMON ANTHONY * NORRIDGE |
分类号 |
H01R13/24;H01R13/658;H05K9/00;(IPC1-7):H05K1/14 |
主分类号 |
H01R13/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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