发明名称 |
A carrier head for providing a polishing slurry |
摘要 |
<p>The disclosure relates to a carrier head of a chemical mechanical polishing apparatus to apply and distribute a polishing slurry to a polishing pad. The carrier head includes a retaining ring (110) having a trough for holding a supply of polishing slurry and one or more channels (132) to channel the polishing slurry to the polishing pad (32). <IMAGE></p> |
申请公布号 |
EP1038636(A2) |
申请公布日期 |
2000.09.27 |
申请号 |
EP20000302427 |
申请日期 |
2000.03.24 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TOLLES, ROBERT, D.;HUEY, SIDNEY |
分类号 |
B24B37/30;B24B37/32;B24B57/02;H01L21/304;(IPC1-7):B24B37/04;B24B41/06 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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