发明名称 |
A fan assisted heat sink cooling device |
摘要 |
A fan assisted heat sink cooling device comprises a planar surface 54 and a chamber 84 for a fan centred around a cooling device central axis (BB) which is perpendicular to the planar surface 54. The peripheral wall 82 of the chamber 84 consists of a plurality of vanes 71. Each two adjacent vanes 71 define a slot (74) there between. Each slot (74) has a slot surface (75) which lies partially between said chamber 84 and said planar surface 54. The slot surface may be arcuate. Each slot (74) may extend substantially to said planar surface 54. The vanes 71 are angled in an approximately opposite manner to the orientation of the fan blades in order to minimise the noise generated by the cooling device when in operation. The cooling device causes air to pass over the cooling vanes 71 twice when in use. |
申请公布号 |
GB2348277(A) |
申请公布日期 |
2000.09.27 |
申请号 |
GB20000016035 |
申请日期 |
1996.12.11 |
申请人 |
* HEWLETT-PACKARD COMPANY |
发明人 |
GUY R * WAGNER |
分类号 |
H01L23/467;(IPC1-7):H01L23/467 |
主分类号 |
H01L23/467 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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