摘要 |
<p>To provide parts soldering apparatus and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board, the parts soldering apparatus has: a stage for positioning a circuit board thereon, which has a solder tip mounted thereon; a loading arm made of a light-transmitting material, for loading a part onto the solder tip; a fluctuating mechanism for pressing the loading arm toward the circuit board; and an optical source for irradiating light onto the part through the loading arm and for melting the solder tip by the conductive heat of the light irradiated onto the part. <IMAGE></p> |