| 摘要 |
A semiconductor package comprises a resin type board or a ceramic type board (7) having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip (8) mounted on the first main surface of the board in face-down relation, a sealing resin layer filled (11) between the lower surface of the semiconductor chip and the upper surface of the board, and flat type external connecting terminals (10) electrically connected to the semiconductor chip and formed on a second main surface of the board with constant pitches in a lattice shape. A fabrication method for fabricating a semiconductor package comprises the steps of aligning connecting bumps of a board with gold bumps formed at an electrode terminal portion of a semiconductor chip so as to place the semiconductor chip on the board, the board having a wiring circuit including connecting pads composed of gold being and flat type external connecting terminals, the wiring circuit being formed on a first main surface of the board, the flat type external connecting terminals being formed on a second main surface of the board, pressuring the aligned board and semiconductor chip so as to contact the connecting portions thereof, filling a sealing resin in a space formed between the upper surface of the board and the lower surface of the semiconductor chip, and curing the filled resin while pressuring the resultant structure so as to prevent the connecting portions from dislocating. <IMAGE> |
