| 摘要 |
A polishing pad (10A,10B) consists of a hard upper-layer member 11 having a lower compressibility and consisting of a material into which a polishing liquid can permeate, a soft lower-layer member 12 having a higher compression rate and consisting of a material into which a polishing liquid can permeate, which are adhered to each other by an adhesive layer 13. A plurality of narrow grooves 14 for facilitating the permeation of polishing liquid into the lower-layer member 12 and partitioning the surface of the pad into a plurality of small regions 15 that can be locally deformed are cut in the pad surface at such an interval that the maximum length of one side of the small region is 10 mm and that groove depth is at least half or more the thickness of the upper-layer member. This allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighbourhood of its outer circumference. <IMAGE> |
