Semiconductor device assembly comprising a leadframe structure

摘要

First (30) and second (40) frame bodies are used to fabricate a semiconductor device. The first frame body (30) includes a die pad (33). The second frame body (40) includes a plurality of leads (42). The die pad is depressed by a predetermined amount (h) which is equal or greater than the thickness of a semiconductor chip (50) to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.