SEMICONDUCTOR MICROVALVE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor microvalve having a large displacement amount of a flexible portion and capable of providing a good sealing characteristic. SOLUTION: A peripheral portion 11 of a first silicon substrate 10 formed with a valve port 10a and a peripheral portion 21 of a second silicon substrate 20 having a valve element 23 for opening/closing the valve port 10a are joined. a valve seat 13 to/from which the valve element 23 contacts/separates is provided on the first silicon substrate 10. The second silicon substrate 20 is provided with the valve element 23 at a center portion of a flexible portion 22 having a flexibility supported to a support portion comprising the peripheral portion 21. A distribution hole through which a fluid passes is formed at a main position of the flexible portion 22. An impurity diffusion layer is formed on the flexible portion 22. A deformed portion 22d previously deformed is formed between the support portion 21 and the valve element in the flexible portion 22 such that an end of the valve element 23 approaches to the one surface of the first silicon substrate 10 as compared with an end of the support portion 21.