发明名称 RESIN COMPOSITION FOR MODIFYING THERMOPLASTIC HYDROXY- CONTAINING RESIN AND METHOD OF USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a modifying composition which shows excellent slip during melt molding, is reduced in the formation of a resinous deposit around a die, and can give a molding free from die lines and excellent in appearance by compounding an ethylene/vinyl acetate copolymer saponificate (EVOH) with an oxide and a higher fatty acid in a specified ratio. SOLUTION: The oxide and the higher fatty acid are each used in an amount of 0.001-10 wt.%. The EVOH used is usually one having an ethylene content of 20-60 mol% and a degree of saponification of at least 90 mol%. It is desirably one having a melt index of 0.1-100 g/10 min at 210 deg.C under a load of 2,160 g. The oxide used is exemplified by silicon oxide, aluminum oxide, cerium oxide, tungsten oxide, molybdenum oxide, or a compound product thereof. The higher fatty acid used is exemplified by a higher fatty acid, a higher fatty acid metal salt, a higher fatty acid ester, or a higher fatty acid amide. EVOH is useful as a resin which is to be modified.
申请公布号 JP2000265025(A) 申请公布日期 2000.09.26
申请号 JP19990069674 申请日期 1999.03.16
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 NIMIYA KENJI;KITA YASUSHI
分类号 C08L29/04;C08K3/20;C08K3/34;C08K5/09;C08K5/10;C08K5/20;(IPC1-7):C08L29/04 主分类号 C08L29/04
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