发明名称 Transducer backing material
摘要 A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.
申请公布号 US6124664(A) 申请公布日期 2000.09.26
申请号 US19980071747 申请日期 1998.05.01
申请人 SCIMED LIFE SYSTEMS, INC. 发明人 MAMAYEK, DON S.;MENDOZA, DENNIS;SUORSA, VEIJO
分类号 G10K11/18;H01L41/107;H04R17/00;(IPC1-7):H01L41/08 主分类号 G10K11/18
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