发明名称 |
Transducer backing material |
摘要 |
A transducer backing material includes a sticky epoxy resin containing tungsten particles and silver particles. A method of applying a backing material to a transducer includes pouring a mixture of epoxy resin, tungsten particles, and silver particles into a mold containing a layer of piezoelectric material, degassing the mixture, and curing the mixture at a pressure of approximately one atmosphere until the mixture dries.
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申请公布号 |
US6124664(A) |
申请公布日期 |
2000.09.26 |
申请号 |
US19980071747 |
申请日期 |
1998.05.01 |
申请人 |
SCIMED LIFE SYSTEMS, INC. |
发明人 |
MAMAYEK, DON S.;MENDOZA, DENNIS;SUORSA, VEIJO |
分类号 |
G10K11/18;H01L41/107;H04R17/00;(IPC1-7):H01L41/08 |
主分类号 |
G10K11/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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