| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which is excellent in skip during melt molding, reduced in the formation of a resinous deposit around a die and can give a molding freed from die lines and having excellent appearance by compounding an ethylene/vinyl acetate copolymer saponificate (EVOH) with an oxide and a boron compound. SOLUTION: The EVOH used is usually one having an ethylene content of 20-60 mol% and a degree of saponification of at least 90 mol%. It is desirably one having a melt index of 0.1-100 g/10 min at 210 deg.C under a load of 2,160 g. The oxide used is exemplified by silicon oxide, aluminum oxide, carium oxide, tungsten oxide, molybdenum oxide, or a compound product thereof. The boron compound used is desirably borax, boric acid, or sodium borate. It is desirabie that 100 pts.wt. EVOH is compounded with 0.001-1 pt.wt. oxide, and 0.001-1 pt.wt. (in terms of boron atoms) boron compound.
|
