| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject paste having excellent quick curing properties, heat resistance and wet adhesion resistance to an organic substrate by using a specific acrylate resin composition. SOLUTION: This paste comprises (A) a urethane diacrylate or methacrylate obtain by reacting a hydroxyalkylacrylic acid or methacrylic acid with a polyalkylene glycol and a diisocyanate, (B) a diacrylate and/or a methacrylate of formula I (R1 is H or CH3; R2 is an alicyclic and/or aromatic >=10C substituent group), (C) a phosphate group-containing acrylate of formula II ((a) to c are each 0 or 1; b+c is 3) and/or a phosphate group-containing methacrylate of formula III, (D) an alkoxysilane containing an alicyclic epoxy group, (E) an organic peroxide and/or an azo compound, (F) an inorganic filler and (G) a liquid compound of formula IV (R3 and R4 are each >=1C alkyl) or formula V (R5 and R6 are each a >=1C alkyl) as essential components. |
