发明名称 PHOTOCURING ADHESIVE COMPOSITION AND METHOD OF BONDING
摘要 PROBLEM TO BE SOLVED: To obtain a photocuring adhesive composition which has excellent surface tackiness and the like at ordinary temperature before cured, and expresses excellent adhesive strength, excellent heat resistance and the like after cured, by compounding a polyester resin, a specific compound and a specified polymerization initiator. SOLUTION: This photocuring adhesive composition comprises (A) a polyester resin preferably having a glass transition temperature of -70 to +30 deg.C, (B) a photocation-polymerizable compound, and (C) a photocation polymerization initiator. The component A is preferably, for example, an epoxy group- containing polyester resin which is obtained by reacting the epoxy groups of a bifunctional or more functional epoxy resin and/or epichlorohydrin with the hydroxyl groups and/or carboxyl groups of a conventional polyester resin which has ester bonds in the main chain and is obtained by the polycodensation reaction of a polybasic acid with a polyhydric alcohol.
申请公布号 JP2000265148(A) 申请公布日期 2000.09.26
申请号 JP19990066556 申请日期 1999.03.12
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI
分类号 C09J167/00;C09J163/00;(IPC1-7):C09J167/00 主分类号 C09J167/00
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