| 摘要 |
PROBLEM TO BE SOLVED: To provide an addition reaction-curing type silicone composition which can be cured to produce a pressure-sensitive silicone adhesive having a low thermal expansion coefficient and a high adhesive property. SOLUTION: This addition reaction-curing type silicone composition which gives a pressure-sensitive silicone adhesive having a low thermal expansion coefficient and a high adhesive property is obtained by heating a mixture comprising an organic polysiloxane resin and polydimethylsiloxane having dimethylvinylsiloxane terminal groups, mixing the obtained flowable blend with spherical molten silica having an average particle diameter of 15μm and an average surface area of 1.3 m2/g, and 1-octadecyl-1,3,5,7,9- pentamethylcyclopentasiloxane cross-linking agent and 3,5-dimethyl-1-hexyn-3-ol catalyst inhibitor, standing to cool the mixture to room temperature, mixing the cooled mixture with a 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane platinum complex catalyst and then defoaming the mixture under vacuum. The organic polysiloxane resin has a number-average mol.wt. of 2,600, has silicon bonded hydroxyl groups in an amount of <1 wt.%, and has a specific (CH3)3SiO1/2/ SiO4/2.
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