发明名称 BONDING OF PARTS
摘要 PROBLEM TO BE SOLVED: To provide a process for bonding parts enabling the proper curing of an adhesive simply by the irradiation with ultraviolet rays without using heat-treatment. SOLUTION: An ultraviolet-curing adhesive 8 is applied to a bonding face of e.g. a magnetic head slider and is subjected to the first ultraviolet irradiation. The adhesive is turned to a slowly curable state. The slider is brought into contact with a flexure 6 and subjected to the second ultraviolet irradiation. The 2nd irradiation energy is stronger than the 1st irradiation energy. The part of the adhesive 8 exposed to the radiation quickly starts the curing reaction by the 2nd irradiation to effect the proper bonding and fixing of the slider and the flexure 6.
申请公布号 JP2000265122(A) 申请公布日期 2000.09.26
申请号 JP19990070259 申请日期 1999.03.16
申请人 ALPS ELECTRIC CO LTD 发明人 SATO HIDEJI
分类号 G11B5/49;C09J5/00;C09J163/00 主分类号 G11B5/49
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