| 摘要 |
PROBLEM TO BE SOLVED: To prevent a flexible printed wiring board (FPC) from being fouled by forming an outer layer with a 4-methyl-1-pentene polymer resin, and employing as an inner layer resin a polyolefin resin containing a high melting point resin having high melting point resin blended in the polyolefin resin, and further providing an outer layer on each upper and lower part of the inner layer. SOLUTION: This release film for manufacture of printed wiring board has an outer layer being a 4-methyl-1-pentene polymer resin (TPX) layer 1, and an inner layer 2 for forming intermediate layer is resin A, and further an outer layer is put on each upper and lower part of the inner layer. Polyolefin resin A2 used in the inner layer 2 is a high melting point resin-containing polyolefin resin having high melting point resin B of a melting point of 180 deg.C or higher usually, preferably, 200 deg.C or higher, preferably in particular, 220 deg.C or higher blended in polyolefin resin A1. This results in that the resin A2 for forming a intermediate layer in a heat-compressing process during the manufacture of FPC never runs out on the copper foil of an outside FPC substrate from the laminated body of a release film. |
