发明名称 Method and apparatus for achieving temperature uniformity of a substrate
摘要 A method for controlling the temperature of a substrate in a processing chamber. The processing chamber employs a heating control over at least two heating zones. Each heating zone is independently controllable according to a measured signal corresponding to the substrate temperature and a user-definable offset.
申请公布号 US6123766(A) 申请公布日期 2000.09.26
申请号 US19970872123 申请日期 1997.05.16
申请人 APPLIED MATERIALS, INC. 发明人 WILLIAMS, MEREDITH J.;BALLANCE, DAVID S.;BIERMAN, BENJAMIN;DEATON, PAUL;HAAS, BRIAN;TAKAHASHI, NOBUYUKI;TIETZ, JAMES V.
分类号 C23C16/46;C30B25/10;C30B25/16;(IPC1-7):C30B25/16 主分类号 C23C16/46
代理机构 代理人
主权项
地址