| 摘要 |
PROBLEM TO BE SOLVED: To enable the use of a moisture-curing one-pack adhesive for the bonding of adherends having low water content or low impregnating property by applying a moisture-curing one-pack adhesive to an adherend. SOLUTION: A moisture-curing one-pack adhesive is applied to at least one of adherends and treated with water and the adherends are bonded with each other. As an alternative, a water-containing intermediate layer is formed on the surface of the moisture-curing one-pack adhesive and adherends are bonded by sandwiching the intermediate layer between the adherends. Preferably, the water content of the intermediate layer is >=10 wt.%, the intermediate layer is selected from water-containing woven fabric, nonwoven fabric, paper, etc., and the adhesive contains an epoxy resin having at least two epoxy groups in the molecule and a ketimine-group containing compound synthesized from a ketone having a substituent on theα-site and a polyamine having at least two amino groups in the molecule.
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