WAFER POLISHING DEVICE AND MANUFACTURE OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a wafer polishing device and a wafer polishing method capable of efficiently polishing a wafer by reducing a use amount of abrasives. SOLUTION: A wafer hold head 1 is provided with a hollow-state head main unit 2, diaphragm 5 extended in the head main unit 2, carrier 6 fixed to the diaphragm 5 to hold one surface of a wafer W to be displaceable in an axial line direction, and a retainer ring 7 provided in an external periphery of the carrier 6 to be displaceable in an axial line direction. An abrasive pocket 26 is formed in a surface abutting to a polishing pad 76 of this retainer ring 7. The abrasive pocket 26 communicates with an abrasive supply part 21 through a flexible pipeline 24 comprising an elastic material. When the wafer W is polished, the retainer ring 7 and the polishing pad 76 are brought into contact so as to clog an opening part of the abrasive pocket 26.